材料科学
复合材料
热导率
热传导
导电聚合物
导电体
聚合物
热的
热阻
热力学
物理
作者
Junwei Gu,Kunpeng Ruan
出处
期刊:Nano-micro Letters
[Springer Science+Business Media]
日期:2021-04-13
卷期号:13 (1): 110-110
被引量:260
标识
DOI:10.1007/s40820-021-00640-4
摘要
Rapid development of energy, electrical and electronic technologies has put forward higher requirements for the thermal conductivities of polymers and their composites. However, the thermal conductivity coefficient (λ) values of prepared thermally conductive polymer composites are still difficult to achieve expectations, which has become the bottleneck in the fields of thermally conductive polymer composites. Aimed at that, based on the accumulation of the previous research works by related researchers and our research group, this paper proposes three possible directions for breaking through the bottlenecks: (1) preparing and synthesizing intrinsically thermally conductive polymers, (2) reducing the interfacial thermal resistance in thermally conductive polymer composites, and (3) establishing suitable thermal conduction models and studying inner thermal conduction mechanism to guide experimental optimization. Also, the future development trends of the three above-mentioned directions are foreseen, hoping to provide certain basis and guidance for the preparation, researches and development of thermally conductive polymers and their composites.
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