光电子学
材料科学
梅萨
激光器
薄脆饼
蚀刻(微加工)
砷化镓
寄生提取
带宽(计算)
光学
图层(电子)
纳米技术
工程类
物理
电信
程序设计语言
计算机科学
作者
K Matsumoto,Junichi Kinoshita,H. Suhara,Atsushi Tanaka,Kazuhiro Shiraishi,M. Morinaga
出处
期刊:Electronics Letters
[Institution of Engineering and Technology]
日期:1988-01-21
卷期号:24 (2): 117-119
被引量:1
摘要
A new mesa structure has been developed for high-speed 1.55μm GaInAsP/InP DFB lasers. This structure was easily fabricated using Ar ion beam etching on broad-areacontacted BH wafers. Laser parasitics were reduced by making the carrier concentration of the n-InP burying layer as low as 5 × 1016cm−3. A 3dB bandwidth of 7GHz was achieved.
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