材料科学
电镀
磨料
钻石
磨损(机械)
扫描电子显微镜
电镀(地质)
电流密度
冶金
阴极
复合材料
涂层
图层(电子)
物理化学
化学
地质学
地球物理学
物理
量子力学
作者
Pei Qi Ge,Yu Fei Gao,Shao Jie Li,Zhi Jian Hou
出处
期刊:Key Engineering Materials
日期:2009-09-01
卷期号:416: 311-315
被引量:5
标识
DOI:10.4028/www.scientific.net/kem.416.311
摘要
Development of high performance diamond impregnated wire is the key of application for fixed-abrasive wire sawing technology. In this paper, some experimental studies were done for development of electroplated diamond wire saw by employing the bright nickel bath. The wire saw electroplating process was developed, the effects of cathode current density and time at tack-on stage on diamond grits density and adhesion between saw matrix and plating coating were discussed. The wire saw cutting experiments were carried out for analysis the used wire wear using the scanning electron microscope (SEM). The experimental results show the optimum tack-on current density to obtain the wire saw with good abrasive distribution and adhesion is 1.5~2.0A/dm2, and the time of pre-plating, tack-on and buildup is 6, 8~10 and 18min in turn. Diamond wire saw wear includes coating wear and grain-abrasion, and the primary wear form is grits pulled-out.
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