New Bismaleimide-Epoxy Resin System

Abstract New functional epoxy resins were prepared by the reaction of dialyldiglycicylbisphenol A (DADGBPA) with diaminodiphenylmethane. DADGBPA was prepared by reaction of o,o′-diallylbisphenol A with epichlorhydrine. By reaction of functional epoxy resins with bismaleimides, new epoxy-bismaleimide resins with good thermostability were obtained. The thermal properties of epoxy resins and epoxy-bismaleimide resins were determined by DSC and TGA measurements. Keywords: Allyl-epoxy resinsEne-reactionThermal curing Notes a Measured in THF at concentration of 1%. a Initial decomposition temperature. b Char yield at 650°C.