薄脆饼
计算机科学
根本原因分析
可制造性设计
过程(计算)
灵敏度(控制系统)
根本原因
预处理器
分析
鉴定(生物学)
半导体器件制造
数据预处理
可靠性工程
软件
噪音(视频)
数据挖掘
电子工程
工程类
人工智能
机械工程
电气工程
植物
生物
程序设计语言
操作系统
图像(数学)
作者
Hung‐Yu Lin,Ching Juan Lee,Chia Wei Huang,Junming Chen,Yuanxun Ethan Wang,Yuen-Liang Lai,Jason Sweis,Ku Fang,Yung-Feng Cheng,Philippe Hurat,Pai Yu-Chin
摘要
Circuit designs are becoming denser and more complex in advanced semiconductor process technologies. The foundry process windows are becoming smaller and smaller which increases sensitivity to wafer surface defects. These defects should be detected early to resolve the root causes and eventually help to improve the yield. Wafer defects are still often inspected manually while the defect counts can reach into the millions. It takes a long time to analyze and review the results while the identification of the root causes may be less accurate and buried in noise. In this paper, UMC advance research teams, in collaboration with the Cadence DFM team, utilized the Pegasus Computational Pattern Analytics (CPA) software to develop an enhanced inspection flow. This flow includes defect data preprocessing, classification, filtering, and reduction of huge data volumes to create visible and easy to review results. By finding more accurate root causes, we could reduce process develop time and finally improve wafer yields.
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