NMOS逻辑
PMOS逻辑
晶体管
材料科学
离子
电子线路
光电子学
MOSFET
重离子
CMOS芯片
电气工程
化学
工程类
电压
有机化学
作者
Jinjin Shao,Ruiqiang Song,Yaqing Chi,Bin Liang,Zhenyu Wu
出处
期刊:Electronics
[Multidisciplinary Digital Publishing Institute]
日期:2022-06-29
卷期号:11 (13): 2043-2043
被引量:2
标识
DOI:10.3390/electronics11132043
摘要
The heavy ion-induced sensitive area is an essential parameter for space application integrated circuits. Circuit Designers need it to evaluate and mitigate heavy ion-induced soft errors. However, it is hard to measure this parameter due to the lack of test structures and methods. In this paper, a test method called TAISAM was proposed to measure the heavy ion-induced sensitive area. TAISAM circuits were irradiated under the heavy ions. The measured sensitive areas are 1.75 μm2 and 1.00 μm2 with different LET values. TAISAM circuits are also used to investigate the layout structures that can affect the sensitive area. When the source region of the target transistor is floating, the heavy ion-induced sensitive area decreases by 28.5% for the target PMOS transistor while it increases by more than 28% for the target NMOS transistor. When the well contacts are added, the heavy ion-induced sensitive area decreases by more than 25% for the target PMOS transistor while it remains unchanged for the target NMOS transistor. Experimental results directly validate that the two structures significantly affect the heavy ion-induced sensitive area.
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