High-resolution X-ray imaging technologies for non-destructive testing of integrated circuits

Integrated circuits (ICs) are an interdisciplinary field involving nanofabrication, materials science, physics, electronics, etc . The rapid evolution of ICs toward miniaturization and high-density architectures necessitates advanced non-destructive testing (NDT) techniques to ensure structural integrity and reliability. In this review, we discuss the indispensable application of X-ray imaging technologies in ICs detection. We first overview the progression of the resolution development and discuss the principles of X-ray imaging technologies. Then, we systematically document the application from micrometer-scale (defect detection, in-situ thermal cycling, and electromigration monitoring for IC packaging) to nanometer-scale (ptychographic X-ray CT, PXCT/burst mode) imaging. These techniques enable 3D visualization of critical IC features, including interconnects, solder joints, and buried defects, while preserving sample integrity, emphasizing their complementary roles in IC diagnostics. We further propose three potential development pathways, including machine learning integration for automated defect recognition, non-destructive full-wafer inspection, and co-optimization of data workflows, to bridge structural analysis with functional performance in emerging semiconductor technologies. This review highlights the transformative role of high-resolution X-ray imaging technologies in addressing the limitations of conventional destructive methods.