Effect of WC nanoparticles on the thermal stability and mechanical performance of dispersion-reinforced Cu composites

WC dispersion-reinforced Cu composites with high thermal stability were fabricated using intermittent electrodeposition and the spark plasma sintering (SPS). WC nanoparticles were dispersed uniformly due to the formation of the Cu cladding WC structures. The pin and impurity drag mechanisms contributed by the dispersed WC impeded the migration of grain boundaries. Based on the kinetic analysis, the improved grain-growth activation energy was observed for 3.0 wt% WC-reinforced Cu (up to 376.4 ± 3.7 kJ/mol), which is over three times higher than that for self-diffusion in pure Cu. The yield strength of this composite increased to 282.9 MPa at 300 °C, which is nine times higher than the value in Cu. This work provides an advanced pathway for designing thermal stable Cu composites for application as heat sinks.