Pre-Ball-Milled Boron Nitride for the Preparation of Boron Nitride/Polyetherimide Nanocomposite Film with Enhanced Breakdown Strength and Mechanical Properties for Thermal Management

Modern electronics not only require the thermal management ability of polymer packaging materials but also need anti-voltage and mechanical properties. Boron nitride nanosheets (BNNS), an ideal thermally conductive and high withstand voltage (800 kV/mm) filler, can meet application needs, but the complex and low-yield process limits their large-scale fabrication. Herein, in this work, we prepare sucrose-assisted ball-milled BN(SABM-BN)/polyetherimide (PEI) composite films by a casting-hot pressing method. SABM-BN, as a pre-ball-milled filler, contains BNNS and BN thick sheets. We mainly investigated the thermal conductivity (TC), breakdown strength, and mechanical properties of composites. After pre-ball milling, the in-plane TC of the composite film is reduced. It decreases from 2.69 to 2.31 W/mK for BN/PEI composite film at 30 wt% content; however, the through-plane TC of composites is improved, and the breakdown strength and tensile strength of the composite film reach the maximum of 54.6 kV/mm and 102.7 MPa at 5 wt% content, respectively. Moreover, the composite film is used as a flexible circuit substrate, and the working surface temperature is 20 ℃, which is lower than that of pure PEI film. This study provides an effective strategy for polymer composites for electronic packaging.