材料科学
本构方程
粘塑性
复合材料
抗压强度
空隙(复合材料)
体积分数
蠕动
纳米-
可塑性
微观结构
有限元法
结构工程
工程类
作者
He Gong,Tongyang Wang,Jianqun Zhu,Shujin Li,Yao Yao
出处
期刊:Journal of Applied Mechanics
[ASME International]
日期:2022-12-02
卷期号:90 (3)
被引量:1
摘要
Abstract Aiming at the potential high-temperature packaging material of the wide band gap semiconductors, experimental and theoretical analysis on the compressive properties of sintered nano-silver was performed. The viscoplastic properties of sintered nano-silver were investigated by compressive experiments with five loading rates, and the effects of loading rate on the ultimate strength and elastic modulus of sintered nano-silver were analyzed. According to the microstructure characteristics of sintered nano-silver, the damage framework including void volume fraction was developed by extending the Gurson–Tvergaard–Needleman model, and the mathematical model between Bonora damage law and void volume fraction was proposed, in which the internal void was assumed to be sphere and cube. A modified constitutive model including the damage model was developed based on the unified creep and plasticity theory for describing the compressive properties of sintered nano-silver. The accuracy of the proposed model was verified by comparing it with the experimental data.
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