材料科学
热导率
散热膏
热接触电导
热阻
热的
复合材料
电子设备和系统的热管理
热接触
接口(物质)
热传导
接触电阻
界面热阻
接触角
热力学
图层(电子)
机械工程
物理
坐滴法
工程类
作者
Changqing Liu,Jiawei Yang,Yifan Li,Jun Fu,Wei Yu,Huaqing Xie
标识
DOI:10.1016/j.surfin.2024.104204
摘要
As an important component of electronic devices, thermal interface materials (TIMs) provide a fast heat dissipation channel, which will significantly improve the reliability and long-term stability of electronic devices. Gel TIMs with good flexibility is a development direction for thermal management in the future. However, the green and environmental issues in the preparation of gel TIMs with good stability are also important problems that must be considered. Here, combining the advantages of green deep eutectics solvents and high thermal conductivity boron nitride, a boron nitride polymerizable deep eutectics solvents gel composite TIMs with high thermal conductivity, good stability and low thermal contact resistance (TCR) has been developed. The thermal conductivity of composite TIMs achieved 1.18 W/m·K at a boron nitride loading of 20 wt%. Under pressure gradient testing (10 Psi-50 Psi), the TCR of composite TIMs decreased to 0.76 K·cm2/W. In the temperature gradient test (30 °C-70 °C), the TCR of the composite TIMs dropped to 0.143 K·cm2/W. Furthermore, in the TCR cycling test, the composites showed better cycling stability. In addition, composite TIMs also show better thermal performance in practical applications. This work provides a green way for the fabrication of gel TIMs with high thermal conductivity, good stability and low TCR.
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