A development of full time anti-hydrometeor shielding metallization films on tiny hermetic image sensor package

A novel of high reliability of full time anti-hydrometeor, oxygen or corrosive gas prevention tiny hermetic package (TH-pack) with Titanium, Copper and Nickel metallization shielding [1] structure is introduced, demonstrated and realized for CMOS image senor application in this study. This state-of-the-art technique and structure improves the low hermetic or weak anti-hydrometeor CMOS image sensor (CIS) package to possess high reliability of anti-hydrometeor performance by sputtering on these well protected metallization shielding layers on DPC ceramic or PCB substrate, dam and heterostructure interface.For CMOS image senor package, if there are seldom particles on the glass lid, and which could affect the formation of image, however, with this well protected metal shielding layers, TH-pack also could improve the CMOS image senor resolution by increase the height of dam which makes particles dark spots become smaller, mediately minimizes the defect affect zone. Considering the glass lid stress and thermal deformation on tiny hermetic package, based on simulation result, TH-pack with higher UV dam can be as buffer layer between glass lid and DPC ceramic [2] or PCB substrate, which means this structure improves the glass lid stress during thermal operation. Hydrometeor and condensation phenomena are the considerable issues for traditional CMOS image sensor package [3], therefore, TH-pack qualified for MSL level 3, gross leak reliability 1000 hours thermal cycles and 1000 hours high temperature with high humidity reliability test. This new tiny hermetic package provides not merely outstanding anti-hydrometeor performance but the robust package structure for CMOS image sensor package applications.