Investigation into Reusability of Disassembled Chip

Reusability of chips disassembled by our self-developed diassembling machine was investigated. Results showed that moisture was the main factor causing chip delamination during diassembling process. Chip delamination issue could be solved through sufficient desiccation of circuit boards before diassembling. Destructive physical analysis (DPA) proved that there were no creep deformations or corrosive occurrences,which might cause potential failures,in 4-5 years old chips. It has been demonstrated that the disassembled chip is of great reusable value.