Bio-Based Epoxy Adhesives Reinforced with Recycled Fillers

材料科学 复合材料 胶粘剂 热固性聚合物 环氧树脂 固化(化学) 动态力学分析 差示扫描量热法 阳离子聚合 聚合 傅里叶变换红外光谱 热机械分析 聚合物 填料(材料) 热分析 极限抗拉强度
作者
Alberto Cellai,Lorenzo Pezzana,Valentina Casalegno,Milena Salvo,Marco Sangermano
出处
期刊:Polymers [Multidisciplinary Digital Publishing Institute]
卷期号:17 (22): 2975-2975
标识
DOI:10.3390/polym17222975
摘要

This study explores the potential of a bio-based thermosetting adhesive system incorporating recycled fillers to enhance structural bonding applications while promoting sustainability. Diglycidylether of vanillyl alcohol (DGEVA) was selected as the resin matrix due to its favorable thermomechanical properties and low moisture absorption. To improve mechanical performance and support circular economy principles, recycled carbon fibers (RCFs) and mineral wool (MW) were integrated into the adhesive formulation in varying proportions (10, 30, and 50 phr). A cationic thermal initiator, ytterbium (III) trifluoromethanesulfonate (YTT), was used to permit polymerization. Comprehensive characterization was performed to assess the curing behavior, thermal stability, and mechanical performance of the adhesive. FTIR spectroscopy monitored the polymerization process, while DSC and dynamic DSC provided insights into reaction kinetics, including activation energy, and curing rates. The mechanical and thermomechanical properties were evaluated using dynamic mechanical thermal analysis (DMTA) and shear lap testing on bonded joints. Additionally, SEM imaging was employed to examine fillers’ morphology and joint interfaces. The results indicated that increasing filler content slowed polymerization and raised activation energy but still permitted high conversion rates. Both RCF- and MW-containing formulations exhibited improved stiffness and adhesion strength, particularly in CMC joints. These findings suggest that DGEVA-based adhesives reinforced with recycled fillers offer a viable and sustainable alternative for structural bonding, contributing to waste valorization and green material development in engineering applications.
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