CMOS芯片
MOSFET
碳化硅
可靠性(半导体)
材料科学
阈值电压
栅氧化层
功率半导体器件
电气工程
功率MOSFET
负偏压温度不稳定性
二极管
电子线路
电子工程
电压
功率(物理)
光电子学
工程类
晶体管
物理
量子力学
冶金
作者
Hema Lata Rao Maddi,Susanna Yu,Shengnan Zhu,Tianshi Liu,Limeng Shi,Minseok Kang,Diang Xing,Suvendu Nayak,Marvin H. White,Anant Agarwal
出处
期刊:Energies
[Multidisciplinary Digital Publishing Institute]
日期:2021-12-09
卷期号:14 (24): 8283-8283
被引量:18
摘要
This article provides a detailed study of performance and reliability issues and trade-offs in silicon carbide (SiC) power MOSFETs. The reliability issues such as threshold voltage variation across devices from the same vendor, instability of threshold voltage under positive and negative gate bias, long-term reliability of gate oxide, screening of devices with extrinsic defects by means of gate voltage, body diode degradation, and short circuit withstand time are investigated through testing of commercial devices from different vendors and two-dimensional simulations. Price roadmap and foundry models of SiC MOSFETs are discussed. Future development of mixed-mode CMOS circuits with high voltage lateral MOSFETs along with 4−6× higher power handling capability compared to silicon circuits has been described.
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