Two-Phase Milli/Microchannel Cooling for SiC Power Module using Dielectric Fluid Coolant

This paper proposes a novel approach for thermal management of a SiC power module using a two-phase mili/microchannel coldplate utilizing a dielectric fluid coolant. Simulation results show the superior thermal performance of two-phase mili/microchannel compared to a conventional single-phase coldplate, with a 36% reduction in chip temperature rise and up to 400 times better reliability. The experimental validation is done by comparison of two-phase cooling and single-phase cooling performance. The test results show that up to 81% improvement in junction temperature rise and 2.41 times reduction of thermal resistance of coldplate are achieved, which demonstrates the advantages of two-phase mili/microchannel cooling.