生产线后端
像素
计算机科学
人工智能
光学接近校正
直线(几何图形)
全球定位系统
特征(语言学)
算法
过程(计算)
模拟
计算机视觉
模式识别(心理学)
数学
几何学
互连
哲学
操作系统
语言学
电信
计算机网络
作者
Ahmed Hamed Fatehy,Hazem Hegazy,Omar El-Sewefy,Mohamed Dessouky,Ashraf Salem
出处
期刊:Journal of micro/nanopatterning, materials, and metrology
[SPIE - International Society for Optical Engineering]
日期:2023-06-29
卷期号:22 (02)
标识
DOI:10.1117/1.jmm.22.2.023401
摘要
BackgroundLine-end-pull-back (LEPB) is a well-known systematic defect in BEOL metal layers, where a line-end (LE) tip is pulled back from its desired location due to lithography (litho) process effects. Severe LEPB directly affects BEOL connectivity and may lead to partial or total metal-via disconnection.AimLEPB can be characterized through model-based litho simulations but at the cost of high computational resource consumption. This study aims to provide a fast and accurate approximation of computationally expensive litho simulations through regression-based machine learning (ML) modeling.ApproachLEPB modeling is approached through the LightGBM model. Input features were approached using density pixels, density concentric circle area sampling (CCAS), and geometrical positioning surveying (GPS), which is an edge-based engine that provides a direct one-to-one mapping between model features and geometrical measurements between the LE as a point-of-interest and its surrounding contextual patterns. The importance of LightGBM features by splits was employed to reduce features across the used approaches.ResultsThe reduced features of GPS produced almost the same modeling quality (training: RMS = 0.571 nm, δEWD = 0.297 nm, and R2 % = 98.74 % , and testing: RMS = 0.643 nm, δEWD = 0.344 nm, and R2 % = 98.40 % ) with −22.22 % fewer number of features and less feature extraction runtime compared to the full features set of density pixels and density CCAS approaches.ConclusionsCompared to model-based litho simulations, the obtained calibrated ML models can be used to provide fast, yet accurate predictions of the amounts of pull-back or extensions introduced at LEs near vias, eliminating a major contributor to systematic IC yield loss.
科研通智能强力驱动
Strongly Powered by AbleSci AI