半导体工业
制造工程
半导体
半导体器件制造
等离子体
工程类
材料科学
计算机科学
光电子学
物理
核物理学
薄脆饼
作者
Kapil Sawlani,Ali Mesbah
出处
期刊:Elsevier eBooks
[Elsevier]
日期:2024-01-01
卷期号:: 97-138
被引量:1
标识
DOI:10.1016/b978-0-323-99135-3.00010-5
摘要
Modern semiconductor processes are estimated to generate about 1 TB/tool/day of data, including sensor data, event data, alarm data, and recipe information, amongst others. With the advent of advanced tool sensing capabilities and product metrology, smart manufacturing practices are poised to create unprecedented opportunities for the semiconductor industry. This chapter provides an overview of the applications of artificial intelligence (AI) in the lifecycle of plasma-assisted etch and deposition processes, which are central to the manufacture of semiconductor chips. AI applications are rapidly proliferating in the semiconductor industry with the goals of accelerating the time-to-market of new processes and products, as well as the relentless drive for greater productivity and yield.
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