微观结构
材料科学
色散(光学)
撞击坑
扫描电子显微镜
图层(电子)
亚稳态
相(物质)
阴极射线
光学显微镜
复合材料
冶金
液相
电子显微镜
电流(流体)
表层
温度梯度
透射电子显微镜
梁(结构)
电子
光学
惰性
场发射显微术
作者
Zhiming Zhou,Tao Zhou,Linjiang Chai,Jian Tu,Yaping Wang,Weijiu Huang,Xiao Hong-Mei,Zhipei Xiao
标识
DOI:10.1590/1516-1439.323714
摘要
Microstructures of CuCr25 and CuCr50 alloys treated by high current pulsed electron beam (HCPEB) were investigated in this work. The microstructure and solidification behavior of the Cr-rich phases were characterized by scanning electron microscopy (SEM). Results show that a remelting layer of 3~5 μm is formed on the surface of Cu-Cr alloys. The microstructure of the remelting layer reveals that both the fine dispersion of Cr-rich spheroids and the craters appear after HCPEB treatment. This means that metastable liquid phase separation occurs during rapid solidification under HCPEB treatment. In addition, the appearance of relatively large craters in the subsurface of Cr-rich particles with the distance about 5-10 μm provides direct evidences supporting results reported by other researchers in terms of numerical simulation temperature field of HCPEB treatments.
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