Detection of Surface Cracks in Metals Using Microwave and Millimeter-Wave Nondestructive Testing Techniques—A Review

无损检测 微波成像 极高频率 微波食品加热 灵敏度(控制系统) 计算机科学 标杆管理 声学 机械工程 工程类 电子工程 电信 物理 量子力学 业务 营销
作者
Mohamed A. Abou‐Khousa,Mohammed Saif ur Rahman,Kristen M. Donnell,Mohammad Tayeb Al Qaseer
出处
期刊:IEEE Transactions on Instrumentation and Measurement [Institute of Electrical and Electronics Engineers]
卷期号:72: 1-18 被引量:68
标识
DOI:10.1109/tim.2023.3238036
摘要

Integrity assessment of metallic structures requires inspection tools capable of detecting and evaluating cracks reliably. To this end, many microwave and millimeter-wave nondestructive testing and evaluation (NDT&E) methods have been developed and applied successfully in the past. Detection of fatigue cracks with widths less than $5~\mu \text{m}$ using noncontact microwave-based inspection methods was demonstrated in the 1970s. Since their introduction, these methods have evolved considerably toward enhancing the detection sensitivity and resolution. Undertaking key application challenges has attracted considerable attention in the past three decades and led to the development of the near-field techniques for crack detection. To address a need that cannot be fulfilled by other NDT&E modalities, innovative noncontact microwave and millimeter-wave NDT&E methods were devised recently to detect cracks of arbitrary orientations under thick dielectric structures. While the reported methods share the same underlying physical principles, they vary considerably in terms of the devised probes/sensors and the application procedure. Consequently, their sensitivity and resolution as well as their limitations vary. This article reviews the various crack detection methods developed to-date and compares them in terms of common performance metrics. This comprehensive review is augmented with experimental comparisons and benchmarking aimed to benefit NDT&E practitioners and researchers alike.
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