Abstract A cost‐effective and flexible approach is presented to maskless photolithography using a commercial Liquid Crystal Display (LCD)‐based Masked Stereolithography Apparatus (MSLA) 3D printer. This method enables rapid and flexible patterning of photoresist‐coated silicon wafers without the need for traditional photomasks, as well as the fabrication of large‐area wafer‐scale electrode arrays, offering a highly accessible alternative for microdevice fabrication. The process achieves spatial resolution approaching 20 µm and is demonstrated in the fabrication of gold electrodes for two‐dimensional (2D) material‐based transistors. The electrodes are used to integrate MoS 2 flakes, transferred via an all‐dry deterministic method to fabricate field effect transistors and photodetectors. The results confirm that LCD‐based lithography can produce high‐quality devices comparable to those fabricated with conventional photolithography equipment, making it an attractive solution for low‐cost, high‐precision microfabrication.