NMOS逻辑
阈值电压
栅氧化层
材料科学
光电子学
氧化物
晶体管
栅极电介质
过驱动电压
电压
电介质
等效氧化层厚度
MOSFET
电气工程
工程类
冶金
作者
M. Y. Yunus,M. Rusop,M. Rusop,Tetsuo Soga
出处
期刊:Nucleation and Atmospheric Aerosols
日期:2009-01-01
卷期号:: 570-574
摘要
With the intention of approaching to a technology of 65 nm, many parameters were changed as a step to fabricate the device. The gate oxide thickness was one of the parameters that have been observed. In this project, Silvaco TCAD tools were used to find the optimum value of threshold voltage for 65 nm technology nMOS transistor. The silicon dioxide (SiO2) was used to growth the gate oxide by adjusted the time and temperature of the oxidation process. The thickness of gate oxide was varied from 30 Å to 100 Å and the results were tabulated and observed. As the gate oxide thickness increase, the value of threshold voltage was increased. By using Silvaco TCAD Tools, the results show that the optimum value of threshold voltage is 0.26 V. The value is in the range with ITRS guideline for 65 nm device.
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