Homogeneous integration of off the shelf silicon-based ICs on a silicon substrate

A high density interconnect silicon multi chip package has been designed and fabricated demonstrating the advantage and technical feasibility of the silicon-on-silicon packaging assembly. This new package architecture consists of off-the shelf- silicon IC’s embedded into a silicon substrate resulting in a planar structure. The IC’s are directly bonded into cavities etched in the silicon substrate. After planarization, one or more build-up-interconnect layers are formed above the surface. The direct interconnection of the chips U0 pads eliminates the need for standard chip connections such as wire bonds or solder bumps. A detailed fabrication procedure is presented along with the advantages of the module.