Cantilever Fabrication by Force-Free Release Transfer

Microstructures on a dummy substrate are bonded and transferred to the main substrate in a transfer process. The novel transfer process is developed using a new release layer on the dummy substrate. The release layer consists of a TiO 2 layer and a poly(methyl methacrylate) (PMMA) film. Although the dummy substrate sticks to the main substrate after the bonding, the dummy substrate can be separated from the main substrate without using a pulling force by the UV exposure of the release layer. The force-free release can be obtained by PMMA film degradation by UV exposure. A cantilever with long beams (up to 1000 µm) and a wide base (5 × 3 mm 2 ) is successfully fabricated by the new transfer process.