PVP-Mediated Galvanic Replacement Synthesis of Smart Elliptic Cu–Ag Nanoflakes for Electrically Conductive Pastes

Ω·cm could be achieved after curing at 150 °C for 2 h. Compared with traditional silver microflakes, smart alloy nanoflakes provide much improved conductive interconnection, whose advantage could be attributed to their nanoscale thicknesses. It is also noteworthy that the conductive patterns are able to tolerate multiple bendings at different angles, having good conductivity even after 200 repeated bendings. Therefore, alloy nanoflakes could be a promising candidate conductive filler for flexible printing electronics, electronic packaging, and other conductive applications.