Analysis of copper/fluoropolymer film systems for multilevel interconnects

Characteristics of film materials considered for multilevel interconnects -- Structure and dielectric properties of fluoropolymer films -- Properties of copper films -- Adhesion of metals to fluoropolymers -- Experimental methodology -- Fabrication of fluoropolymer films -- Fabrication of copper films -- Characterization of film materials -- Dielectric properties of fluoropolymer films -- Adhesion of copper to fluoropolymers.