材料科学
铜
制作
金属间化合物
摩擦学
润滑
冶金
镓
原位
金属
电化学
复合材料
纳米技术
电极
化学
物理化学
合金
替代医学
有机化学
病理
医学
作者
Xing Li,Yan Chen,Qi Liu,Guangneng Dong
出处
期刊:Journal of tribology
[ASME International]
日期:2020-11-05
卷期号:143 (7)
被引量:2
摘要
Abstract Interface interaction between gallium-based liquid metal and copper-based materials results in the formation of intermetallic CuGa2 grains. In particular, CuGa2 grains are able to produce a uniform film and the newly formed CuGa2 film holds peculiar characteristics, which have not been fully explored up to now. In this study, we present an electrochemical fabrication method of an in situ CuGa2 film on copper surface. Surface morphology and chemical composition of this film are confirmed. Tribological experiments demonstrate that the CuGa2 film enables good antifriction and antiwear abilities. Furthermore, the lubrication mechanisms of the CuGa2 film are revealed.
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