CMOS芯片
专用集成电路
前端和后端
电子工程
辐射硬化
放大器
炸薯条
数码产品
电气工程
动态范围
计算机科学
工程类
探测器
操作系统
作者
S. Sordo‐Ibáñez,B. Piñero‐García,M. Muñoz‐Díaz,A. Ragel‐Morales,J. Ceballos‐Cáceres,L. Carranza‐González,S. Espejo,Alberto Arias-Drake,J. Ramos‐Martos,J. M. Mora‐Gutiérrez,M. A. Lagos-Florido
标识
DOI:10.1109/tns.2016.2586140
摘要
This paper reports a single-chip solution for the implementation of radiation-tolerant CMOS front-end electronics (FEE) for applications requiring the acquisition of base-band sensor signals. The FEE has been designed in a 0.35μm CMOS process, and implements a set of parallel conversion channels with high levels of configurability to adapt the resolution, conversion rate, as well as the dynamic input range for the required application. Each conversion channel has been designed with a fully-differential implementation of a configurable-gain instrumentation amplifier, followed by an also configurable dual-slope ADC (DS ADC) up to 16 bits. The ASIC also incorporates precise thermal monitoring, sensor conditioning and error detection functionalities to ensure proper operation in extreme environments. Experimental results confirm that the proposed topologies, in conjunction with the applied radiation-hardening techniques, are reliable enough to be used without loss in the performance in environments with an extended temperature range (between -25 and 125 °C) and a total dose beyond 300 krad.
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