Effect of Polishing Load on Slurry Film Thickness in Chemical Mechanical Polishing

Laser inducement fluorescence (LIF) is used to study the effect of polishing parameters on slurry film thickness. The study indicates that the slurry layer decreases with increasing polishing load and increases with increasing polishing speed. However, the current is slow down with the increase polishing load. By analyzing the effects of CMP process parameters involving load and speed on slurry film, the CMP process is controllable in theoretical principle.