Study on the deformation during laser-assisted glass frit bonding process

With the development of optoelectronic technology, laser-assisted glass frit bonding has been widely used in the field of bonding. In this study, three types of glass frits, with thicknesses of approximately 3, 8, and 14 μm, were tested. A set of real-time observation systems was built to monitor the deformation of the glass substrates and the behavior of the glass frit during the bonding process. The angular deformation of the glass substrates on the side of the melting area was calculated based on the interference stripes. The temperature field in the bonding process was calculated via simulations. This was verified using thermocouple temperature measurement. During the bonding process, the maximum temperature of the glass frit reached 665 °C and the glass substrates were concaved in the molten area. The bonding width was linearly related to the angular deformation of the glass substrates, and the Pearson correlation coefficient was r = 0.92. When the thickness of the glass frit was approximately 3 and 14 μm, r exceeded the value of 0.98. In the bonding process, larger pores were able to reduce the deformation of the glass substrates. The samples with almost no pores exhibited a larger increase in the deformation.