发射机
绝缘体上的硅
CMOS芯片
光电子学
波长
通道间距
频道(广播)
波分复用
材料科学
电气工程
硅
工程类
作者
Kaisarbek Omirzakhov,Firooz Aflatouni
标识
DOI:10.1109/isscc49657.2024.10454519
摘要
Optical links play a key role in many applications ranging from data centers to AI systems. Such links typically consist of a light source chip, a transmitter chip (which may be co-integrated with the light source), and a receiver chip. Photonic and electronic devices within optical transmitter/receiver systems are either monolithically integrated or hybrid integrated. While hybrid integration has the advantage of using a high performance dedicated photonic fabrication process and an advanced technology node for electronic integration, the packaging parasitic components could limit the system bandwidth and/or decrease the energy efficiency compared to the monolithic integration approach.
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