Laser Lift‐Off Technologies for Ultra‐Thin Emerging Electronics: Mechanisms, Applications, and Progress

Abstract Due to the advantages of non‐contact processing, high efficiency, high precision, and superior controllability, laser lift‐off (LLO) technologies exhibit excellent material applicability and process compatibility in the lift‐off of ultra‐thin electronic devices. This brings new opportunities for large‐scale manufacturing of emerging electronics that meet ultra‐thin, fragile, and poor high‐temperature resistance. However, this opportunity also comes with formidable challenges from the complex mechanisms of laser‐matter interactions, which hinder comprehensive exploration and fundamental understanding. By elaborating the laser‐material interactions, the photothermal effect, “cold” processing, shockwave effect, and cavitation effect in LLO process from multiple perspectives, this review is devoted to discussing the latest progress and sustainable application of LLO technologies in emerging electronics that are developing toward ultra‐thin, miniaturization, and integration, such as wafer level packaging, displays, energy harvesters, sensors, and memories. Finally, starting from the fundamental principles of material design, light field regulation, and intelligent control system, the challenges and new approaches faced by LLO technologies are explored and fully integrated with future innovative manufacturing concepts and device structures.