Solvent Cleaning to Clean Die from Fluorine After BOSCH Plasma Dicing

BOSCH plasma dicing process switches between different plasma chemistries to provide fluorine-based etching of the silicon while protecting the sidewall of the growing feature with a fluorocarbon layer. Aluminum fluoride formed on the bond pad and fluorocarbon layer at the die side wall will cause critical problem during wire bonding. This study is mainly focus on cleaning method of spraying solvent for cleaning the fluorinated contamination and result was compared with existing cleaning process using DIW rinse. SEM EDS and AES analysis data showing the fluorinated material has been removed from the die will also be shown.