平版印刷术
下一代光刻
模版印刷
无光罩微影
抵抗
计算光刻
电子束光刻
极紫外光刻
材料科学
X射线光刻
多重图案
纳米技术
光刻
计算机科学
光电子学
图层(电子)
作者
F. Laulagnet,Jacques-Alexandre Dallery,Laurent Pain,Michael May,B. Hemard,Franck Garlet,Isabelle Servin,C. Sabbione
出处
期刊:Journal of micro/nanopatterning, materials, and metrology
[SPIE - International Society for Optical Engineering]
日期:2023-06-12
卷期号:22 (04)
标识
DOI:10.1117/1.jmm.22.4.041404
摘要
Electron beam (E-beam) direct write (EBDW) lithography is a worldwide reference technology used in laboratories, universities, and pilot line facilities for research and development. Due to its low writing speed, EBDW has never been recognized as an acceptable industrial solution, except for optical mask manufacturing. Nevertheless, its natural high-resolution capability allows for low-cost patterning of advanced or innovative devices prior to their high-volume manufacturing ramp-up. Due to its full versatility with almost all types of chemically amplified resists, EBDW is a perfect complementary solution to optical lithography. We demonstrate the compatibility of EBDW lithography with advanced negative tone development resists and the possibility of setting up a hybrid E-beam/193i lithography process flow with high performance in terms of resolution and mix and match overlay. This high-end lithography alliance offers flexibility and cost advantages for device development research and development, as well as powerful possibilities for specific applications such as circuit encryption, as discussed at the end of our study.
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