First-principles analysis of structural stability, mechanical anisotropy, and thermophysical and electronic properties of Cu–Pd intermetallic compounds: a comparative study of CuPd, CuPd3, Cu3Pd, and Cu4Pd

Cu 3 Pd offers superior stiffness, thermal stability, and toughness, making it ideal for microelectronic packaging. In contrast, Cu 4 Pd provides greater ductility and thermal compliance for applications with large thermal fluctuations.