与非门
闪光灯(摄影)
计算机科学
可靠性(半导体)
步伐
大容量存储
嵌入式系统
计算机硬件
逻辑门
艺术
功率(物理)
物理
大地测量学
算法
量子力学
地理
视觉艺术
作者
Rino Micheloni,Luca Crippa,Cristian Zambelli,P. Olivo
出处
期刊:Computers
[Multidisciplinary Digital Publishing Institute]
日期:2017-08-10
卷期号:6 (3): 27-27
被引量:54
标识
DOI:10.3390/computers6030027
摘要
Nowadays, NAND Flash technology is everywhere, since it is the core of the code and data storage in mobile and embedded applications; moreover, its market share is exploding with Solid-State-Drives (SSDs), which are replacing Hard Disk Drives (HDDs) in consumer and enterprise scenarios. To keep the evolutionary pace of the technology, NAND Flash must scale aggressively in terms of bit cost. When approaching ultra-scaled technologies, planar NAND is hitting a wall: both academia researchers and industry worked to cope with this issue for several decades. Then, the 3D integration approach turned out to be the definitive alternative by eventually reaching mass production. This review paper exposes several 3D NAND Flash memory technologies, along with their related integration challenges, by showing their different layouts, scaling trends and performance/reliability features.
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