Impact of Process Parameters on Vacuum Fluxless Solder Reflow Performance in Backend Applications with Bump Pitch of 15µm and Below

In this paper, an experimental methodology was developed to characterize reflow performance for next-generation micro-bumps using bump shapes distinguished by the ratio of bump height to diameter. Existing technology deals with 50µm bumps; this study analyzed micro-bumps with a pitch of 15µm and below, correlating reflow performance to reflow process parameters.