Single-grain scratching of SiCf/SiC composite under minimum quantity lubrication: Force and material removal mechanism study

As one of the most novel fiber-reinforced ceramic matrix composites, SiCf/SiC composites are difficult to be processed machine materials. On top of that, the underlying material removal mechanism not yet completely understood. Along these lines, in this work, single-grain scratching orthogonal tests with different MQL methods were carried out to systematically analyze the influence of the different processing directions and lubrication methods on the material removal lubrication mechanism and the scratching force in the scratched surfaces. From the acquired results, it was demonstrated that the scratch force was the smallest when the processing direction is was 0° to the fiber direction. In addition, the utilization of MQL from vegetable oil can effectively reduce the cutting force. Diamond indenter caused significant damage to the surface of SiCf/SiC composites when the machining direction was 90° to the fiber direction, while narrow but deep grooves on the surface were observed when the angle was 0°. The dominant mode of material removal of SiCf/SiC composites was a brittle fracture, and the damage features mainly included direct fiber breakage, matrix fragmentation, fiber pullout, and fiber outcropping. The increase of the processing ratio of 0° and implementation of vegetable oil for MQL was proven as one of the best methods.