Review and Thermo-Fluids Numerical Modeling on Electrostatic Chuck

Electrostatic chucks (ESC) are used in advanced semiconductor manufacturing to clamp wafer combining with backside gas cooling and coolant channel to control wafer temperature during processing. To analyze the complexity and difficulties of ESC, we reviewed published studies on ESC, including chucking principle and de-chuck models. Based on this in-depth analysis, we studied the heat transfer of the ESC system and built numerical models to investigate the thermal performance of coolant channel design. The numerical results have been utilized as guide for high performance ESC design.