Construction of Thermal Conductivity Network and Performance Optimization of Polymer Substrate

With the development of electronic packaging technology toward high frequency, high speed, multi-function, high performance, small size, and high reliability, effective heat dissipation of devices has become an important basis for ensuring the safe operation of electronic products, and the substrate material is one of the key factors affecting the heat dissipation efficiency. Polymer-based electronic packaging substrate materials are playing an increasingly important role in the new generation of electronic packaging materials. Among them, epoxy resin is a potential matrix of composite materials due to its excellent properties. Therefore, this topic focuses on key scientific issues such as the mechanism of the internal interface and spatial structure of high thermal conductivity polymer substrate materials on performance, and conducts in-depth and systematic research on the preparation and performance optimization of polymer substrate materials. Through the implementation of the project, several new polymer composite substrate material systems with high thermal conductivity, low thermal expansion coefficient, and low dielectric constant can be obtained, as well as the optimized design and controllable preparation technology prototype.