缩聚物
材料科学
高分子化学
表面改性
化学
聚合物
复合材料
物理化学
作者
Wenhui Fan,Nianmin Hong,Quan Sun,Menglu Li,Wenxin Fu
出处
期刊:Polymer Chemistry
[The Royal Society of Chemistry]
日期:2022-01-01
卷期号:13 (15): 2187-2194
被引量:13
摘要
A series of BCB-functionalized organosilicon materials were prepared by a facile Piers–Rubinsztajn polycondensation and Heck coupling post-modification method, rendering a simple and efficient option for advanced packaging dielectric materials.
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