Study the chemical mechanical polishing on sapphire substrate

Chemical-mechanical polishing(Chemical Mechanical Polishing,CMP)is currently only able to provide the global planarization technology,its mechanism of polishing is currently the most popular. A survey of some models was given which consider the polishing properties of polishing liquid and polishin pads,and the relevant characteristics of each model was analyzed,at last the development and research directions of the CMP model was prospected.