薄脆饼
材料科学
硅
胶粘剂
阳极连接
复合材料
研磨
过程(计算)
粘接
空白
晶片键合
激光器
通过硅通孔
光电子学
图层(电子)
光学
计算机科学
物理
操作系统
作者
P. Montmat,T. Enot,M. De Marco Dutra,M. Pellat,Frank Fournel
标识
DOI:10.1016/j.mee.2017.03.008
摘要
This paper concerns the study of a temporary bonding process: 3MTM Wafer Support System. This process is dedicated to the handling of thin silicon wafers with a glass carrier bonded with a UV curable polymer. The dismounting process is achieved after a laser treatment. Firstly, the 300 mm bonding process leads to a very homogeneous bonded structure without any bonding defects. The morphology of the bonded structure is mainly dependent of the morphology of the glass. Secondly this process is also compatible with a back – grinding process and the thinned silicon structure can be processed up to 250 °C. When using a blank silicon wafer, the 3MTM dismounting process (laser and peeling) leads to a silicon thin wafer without any cracks, chippings or adhesive traces. Finally the laser process can be removed from the debonding steps and a single mechanical dismounting process can be used.
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