材料科学
纳米尺度
联轴节(管道)
研磨
机制(生物学)
过程(计算)
分子动力学
复合材料
纳米技术
计算机科学
认识论
操作系统
哲学
计算化学
化学
作者
Binbin Meng,Dandan Yuan,Shaolin Xu
标识
DOI:10.1016/j.ceramint.2018.10.175
摘要
In this study, the influence mechanism of the coupling effect on the material removal process of SiC in nanoscale condition is investigated using the molecular dynamics method. The geometrical characteristics of a machined surface and the damage distribution under a coupling effect are analyzed. The influence law of the coupling effect on surface/subsurface features is also presented. According to the analysis results, the repeated and interference scratches with multi-abrasives, large-area machined surface morphology, and damage distribution are analyzed. This study is significant in understanding the removal mechanism of SiC during the grinding process at the nanoscale.
科研通智能强力驱动
Strongly Powered by AbleSci AI