光电子学
炸薯条
微电子
材料科学
光调制器
晶体管
硅
放大器
光学
硅光子学
CMOS芯片
计算机科学
电气工程
相位调制
物理
电信
工程类
电压
相位噪声
作者
Qianfan Xu,Bradley S. Schmidt,Sameer Pradhan,Michal Lipson
出处
期刊:Nature
[Nature Portfolio]
日期:2005-05-01
卷期号:435 (7040): 325-327
被引量:2311
摘要
Metal interconnections are expected to become the limiting factor for the performance of electronic systems as transistors continue to shrink in size. Replacing them by optical interconnections, at different levels ranging from rack-to-rack down to chip-to-chip and intra-chip interconnections, could provide the low power dissipation, low latencies and high bandwidths that are needed. The implementation of optical interconnections relies on the development of micro-optical devices that are integrated with the microelectronics on chips. Recent demonstrations of silicon low-loss waveguides, light emitters, amplifiers and lasers approach this goal, but a small silicon electro-optic modulator with a size small enough for chip-scale integration has not yet been demonstrated. Here we experimentally demonstrate a high-speed electro-optical modulator in compact silicon structures. The modulator is based on a resonant light-confining structure that enhances the sensitivity of light to small changes in refractive index of the silicon and also enables high-speed operation. The modulator is 12 micrometres in diameter, three orders of magnitude smaller than previously demonstrated. Electro-optic modulators are one of the most critical components in optoelectronic integration, and decreasing their size may enable novel chip architectures.
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