Reliability of chip components lead-free solder joints with voids under thermal cycle

The finite element analysis(FEA) models of chip component lead-free solder joints with voids were set up,the effects of void location and void area on the thermal fatigue life of lead-free solder joints were studied under thermal cycle.The results show that both the void location and the void area possess significant effects on the thermal fatigue life of solder joints.With the fixed location in the middle of solder joints when the void areas are 7.065×10–4,1.256×10–3,1.963×10–3 and 2.826×10–3 mm2 respectively,the solder joint fatigue lives are 1 840,2 022,1 464 and 1 461 cycles.The thermal fatigue life of solder joints with small void area is not longer than that of solder joints with large void area.