抛光
磨料
材料科学
半导体
光学玻璃
光电子学
光学
复合材料
物理
标识
DOI:10.3103/s1063457620010037
摘要
Studies on the development of modern methods of precision surface polishing for the production of electronic device and optical system elements from glass and optical and semiconductor crystals are reviewed. The mechanisms that underlie material removal from the workpiece surface are described for polishing with a tool with bound abrasive, mechanical polishing with polishing powder suspensions, and chemicomechanical polishing. The results of the study of the mechanism that underlies the formation of the optical surface nanoprofile during polishing are presented and the relevance of studying the regularities of ultrasmooth surface formation during chemicomechanical polishing is emphasized.
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