High-temperature resistant polypropylene films enhanced by atomic layer deposition

Abstract Last two decades has witnessed various technical programs towards the development of new dielectric films for high temperature and high energy density capacitor technology. Yet, the organic polypropylene film still holds its top position for film capacitors required for electric and electronic power applications such as power grid, hybrid electric vehicles, oil and gas exploration, and aviation. However, its low temperature stability determined by its structural nature limits its further adoption for more rising markets. This work thus developed a creative method (ultrathin coating of inorganic compound using atomic layer deposition) to increase the high temperature stability and the dielectric strength of such a strategically important polymer film from below 105 °C to above 140 °C. Several techniques also confirmed the effective minimization of the dimensional change and crystallinity loss at higher temperatures, i.e., Thermomechanical analysis, Dynamic mechanical analysis, Dynamic Scanning calorimetry, x-ray diffraction and electron microscopy techniques. This breakthrough discovery adds a huge value to the commercial PP films and relevant capacitor industry and will extend the operation of high-performance PP film capacitors to various high standard applications.