光电二极管
材料科学
光电子学
晶体管
平面的
电压
逻辑门
集成电路
足迹
碳纳米管
电子线路
数字电子学
光电探测器
环形振荡器
噪音(视频)
电子工程
计算机科学
功率(物理)
电气工程
偏压
数码产品
纳米技术
电气元件
和大门
作者
Xiao Luo,Haoyu Zhang,Haoyun Liu,Guanhua Long,Xuehao Zhu,Yong Zhang,Meiqi Xi,Jiahao Zhang,Yuanhao Kou,Lan Bai,Yu Cao,Sheng Wang,Chuanhong Jin,Qi Li,Lian‐Mao Peng,Xuelei Liang
出处
期刊:ACS Nano
[American Chemical Society]
日期:2026-06-17
卷期号:20 (25): 18406-18418
标识
DOI:10.1021/acsnano.6c04995
摘要
Carbon nanotubes (CNTs), combining excellent electrical and optoelectronic properties with low-temperature processability, provide a compelling materials platform for monolithic three-dimensional (M3D) integration that unifies digital logic in complementary field-effect transistor (CFET) architecture and functional sensing elements with three-dimensionally structured nondigital functional blocks. However, such a fully integrated system has not yet been experimentally demonstrated. Here, we report CNT-based digital circuits implemented in a true CFET architecture, in which vertically stacked P- and N-FETs share an identical footprint and exhibit well-balanced performance through structural engineering. A full suite of logic functions, including inverters, NOR, OR, NAND, AND gates, as well as a 4-transistor static random-access memory cell and a five-stage ring oscillator are successfully demonstrated. The CFET inverters exhibit rail-to-rail operation with large noise margins and a peak voltage gain of 147 at a supply voltage of 1 V, while maintaining a gain of 9.7 with only 3.3 pW static power consumption at 0.2 V. In parallel, CNT photodiodes are vertically stacked and cascaded to form a 3D optical sensor that delivers nearly twice the photovoltage of planar counterparts. By monolithically integrating the 3D CNT photodiode with a CNT-based CFET inverter, we further demonstrated a prototype "sensing-and-computing" module in which optical power and spectral information are directly sensed and processed within a single monolithic CNT-based block. This work establishes CNTs as a unified platform for high-density, low-power M3D integration toward near-/in-sensor and edge-computing applications.
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