Scalable Fabrication and On‐Chip Integration of Single Photon Emitters

ABSTRACT Single‐photon emitters (SPEs) are essential components in various quantum technologies. Although significant progress has been made in developing diverse types of SPEs, their practical deployment remains hindered by challenges in wafer‐scale scalability and deterministic fabrication. Hence, research efforts have increasingly focused on wafer‐scale SPE platforms capable of producing large‐scale emitter arrays with high yield, precise positioning, uniform properties, and controllable costs. This review summarizes recent advances in the wafer‐scale fabrication and integration of single photon emitters, highlighting key developments in on‐chip integration and applications. We categorize fabrication methods across different material systems—such as 2D materials, solid‐state defects, quantum dots, and colloidal quantum dots—based on their ability to achieve large arrays with spectral uniformity and scalability. Furthermore, the progress in on‐chip integration of SPEs is showcased for practical deployment and applications with optoelectronic integration. By exploring these advances and their implications for the future of scalable single‐photon generation and manipulation, this review aims to offer a roadmap for further progress in optoelectronic integration and application.